| Customization: | Available |
|---|---|
| After-sales Service: | on-Line Service |
| Warranty: | One Year |
Suppliers with verified business licenses
Dual-Chamber Four-Target Magnetron Sputtering Coating Machine
I. Application Areas
This equipment is used for depositing metal films, ceramic films, dielectric films, etc., via the magnetron sputtering method. Users can select from single-target independent operation, four-target sequential operation, or any combination of four targets for co-sputtering based on process requirements. The machine consists of two vacuum chambers: the main chamber and the preparation chamber. The main chamber is used for film deposition, completing the primary coating process. The preparation chamber is connected to the main chamber via a high-vacuum gate valve and can be used for plasma cleaning of substrates before and after coating. It also allows for substrate replacement without breaking the vacuum in the main chamber.
II. Performance Parameters
Coating Chamber:
Effective dimensions: approximately Φ500×550; ultimate vacuum: 5×10<sup>-5</sup> Pa;
Magnetron targets: 3″ × 4, compatible with DC/RF; adjustable target-to-substrate distance and angle; equipped with electric/pneumatic shutters;
Substrate size: 4″, capable of rotation and lifting;
Heating temperature: 600°C, temperature control accuracy: ±1°C;
Sample stage rotation: 2-20 rpm adjustable;
Optional: bias voltage, thickness monitor, and thin-film gauge.
Preparation Chamber:
Effective dimensions: approximately Φ300×350; ultimate vacuum: 5×10<sup>-4</sup> Pa;
Chamber features self-heating and bake-out degassing functionality;
Capable of ion sputtering cleaning for substrates;
Equipped with a substrate holder for loading up to 4 substrates at once;
Substrates are transferred using a magnetic sample transfer rod.
){kind=link}