Diamond Wire Cutting Machine Rj-Dwc150d

• Customization: Available
• Blade Type: Diamond Wire Saw
• Manufacturing Process: Cutting
• Model NO.: RJ-DWC150D
• Application: Laboratory Material Cutting
• Condition: New
• Max Cutting Size: Ø150mm × 150mm (6")
• Wire Diameter: ≤0.45mm (Options: 0.125-0.42mm)
• Wire Speed: 0-4m/S Adjustable
• Transport Package: Wooden Case
• Specification: Customized
• Trademark: RJ
• Origin: Zhengzhou, China

Product Description

1. Equipment Name & Model

• Fully Automatic Diamond Wire Saw
  Model: RJ-DWC150-A
  Type: Continuous Cutting System

2. Core Technology & Features

• Diamond Wire Cutting Technology
  • Motion Mode: Single Wire Reciprocating Motion
  • Wire Length: ≤270m
  • Tension System: Pneumatic Tensioning System (0-1MPa adjustable)
• Precision Control
  • Dimensional Accuracy: ±10μm
  • Axis Control: Y/Z/R-axis Stepper Motors
  • Worktable Rotation: 360° Programmable Rotation

3. Compatible Materials

• Ceramics: Alumina/Zirconia, Semiconductor Ceramics
• Crystals: Sapphire, Silicon, SiC, CsI
• Glass: Optical/Quartz, Chalcogenide
• Metals: Ti/Fe/Al Alloys, Ferrite
• Biomedical: Tissue Specimens, Bone-Implant Samples
• Others: Thermoelectric , IR Optical (ZnSe)

4. Technical Specifications

Parameter	Specification
Max Cutting Size	Ø150mm × 150mm (6")
Wire Diameter	≤0.45mm (options: 0.125-0.42mm)
Wire Speed	0-4m/s adjustable
Power Supply	220V 50Hz, <550W
Dimensions	600×600×1100mm
Weight	~500kg

5. Key Components

• Standard Accessories:
  • Tension Wheels (2 pcs)
  • Guide Wheels (2 pcs)
  • Diamond Wire (2 rolls)
  • Cooling Pump (1 unit)
• Optional Accessories:
  • Swing Mechanism (for hard materials)
  • Heating Stage
  • DX-100 Single Crystal Orientator

6. Applications

• Semiconductor: Wafer dicing
• Gem Processing: Jade/Sapphire cutting
• Research: Geological sample preparation

7. Key Advantages

• High Efficiency: Long-life diamond wire (≤270m)
• Precision: ±10μm tolerance, digital axis control
• Versatility: Cuts hard/brittle materials and soft tissues