Triple-Target Magnetron Sputtering Coating System (Top-Mounted Sample Stage)

• Customization: Available
• After-sales Service: on-Line Service
• Warranty: One Year
• Model NO.: RJ-CKDS450-3S
• Type: Vacuum Coating
• Coating: Vacuum Coating
• Substrate: Steel
• Certification: CE
• Condition: New
• Sample Stage: Dia. 100mm
• Heating Temperature: Max 500ºC
• Rotate Speed: 1-30rpm Adjustable
• Chamber Material: High Purity Quartz
• Transport Package: Wooden Case
• Specification: Customized
• Trademark: RJ
• Origin: Zhengzhou, China

Product Description

 

Triple-Target Magnetron Sputtering System (1×500W DC + 2×500W RF)
(Modular Design with Top-Loading Vacuum Chamber)

 

Key Specifications

Component	Parameters
Sample Stage	- Diameter: Φ100-200mm - Heating: Up to 500°C (±1°C) - Rotation: 1-20 rpm adjustable
Magnetron Targets	- Quantity: 3 (2" standard, 1"/2" optional) - Cooling: Water-cooled (10L/min flow rate)
Vacuum Chamber	- Dimensions: φ450mm × 500mm (stainless steel) - Viewport: φ100mm - Loading: Top-opening design
Gas Control	- Mass flow controllers: 2 channels (100sccm each, expandable to 4 channels)
Vacuum System	- Pump: Turbo molecular pump (150L/s) + Rotary vane pump (4L/s) - Base pressure: 10<sup>-5</sup> Pa (achievable in 20 mins) - Ports: KF40 (inlet), KF16 (outlet)
Power Supply	- DC: 2×500W (for metallic films) - RF: 1×500W (for dielectric films)
General	- Power: AC 220V, 50/60Hz, 3.5KW - Dimensions: 1100mm × 650mm × 1280mm - Weight: 300kg

 

Features

1. Modular & Customizable
   • Target options: 1" or 2" configurations
   • Upgradable power supplies (300W-1000W DC/RF/pulsed)
2. High Efficiency
   • Electromagnetic valve-controlled gas/pump system allows sample exchange without venting.
   • Optional integrated industrial PC for automated control (pump/power/gas flow).
3. Wide Applications
   • Thin-film R&D: Ferroelectric, conductive, alloy, semiconductor, ceramic, optical, oxide, and PTFE coatings.

 

Technical Highlights

• Precision Control: ±1°C temperature stability, multi-gas blending capability.
• Compact Design: Optimized for lab-scale research with user-friendly operation.
• High Vacuum Performance: 10^-5 Pa base pressure with rapid pump-down.

 

Comparison with Competing Models

• Advantage 1: Dual DC + RF power configuration enables simultaneous metal/dielectric deposition.
• Advantage 2: Top-loading chamber design minimizes particulate contamination.

For OEM/ODM requests, additional configurations (e.g., 4-target systems, pulsed DC) are available.