| Customization: | Available |
|---|---|
| After-sales Service: | on-Line Service |
| Warranty: | One Year |
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This user-friendly system features a "flip-top" vacuum chamber for easy operation, suitable for thermal evaporation and sputter deposition of metals, dielectrics, and organic materials.
Integrated design with the vacuum chamber partially recessed into the support frame.
Chamber options: Flip-top lid or bell-jar configuration.
Multi-deposition technologies:
Thermal evaporation (metals & organics)
Low-temperature evaporation (organic films)
Magnetron sputtering (metals, oxides, nitrides, insulators)
Deposition source layout: Sources mounted at the bottom, substrates at the top (supports wafers up to 6 inches in diameter).
Substrate handling: Heating, rotation, and Z-shift adjustment available.
Glovebox-compatible: Designed for seamless integration with existing glovebox systems.
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Magnetron sputtering (metals, oxides, nitrides, insulators)
Vacuum Coating System Description (English Version):
This system is a popular universal platform in our coating series, featuring a front-opening box-style chamber suitable for multi-source magnetron sputtering, as well as thermal evaporation and electron beam evaporation.
Integrated design with the vacuum chamber mounted directly on the control system's electronics cabinet.
Multi-deposition technologies supported:
Thermal evaporation & low-temperature evaporation (for metals and organic materials)
Magnetron sputtering (metals, oxides, nitrides, and insulators)
E-beam evaporation (compatible with most materials except organics)
Flexible source configuration:
Deposition sources (thermal, e-beam) typically installed at the bottom.
Sputtering sources can also be mounted at the top if required.
Substrate handling:
Accommodates wafer sizes up to 11 inches.
Options include heating, rotation, bias voltage, and Z-shift adjustment.
Configurable with planetary sample stages, source shutters, and substrate shutters.
Automation options:
Ranges from manual thermal evaporation to fully automated process control.
Optional fast-loading chamber for rapid sample exchange.
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Electron beam (e-beam) evaporation
Magnetron sputtering (metals, oxides, nitrides, insulators)
High-Volume Vacuum Coating System
Key Features:
Tall-chamber design optimized for thermal evaporation, low-temperature thermal evaporation, and e-beam evaporation, featuring extended working distance for superior film uniformity
Vacuum chamber mounted directly on the control system electronics cabinet
Ideal for evaporation techniques requiring longer working distances to achieve optimal uniformity
Near-90° evaporation incidence angle enables excellent lift-off performance for photolithographic devices
Supports multi-process deposition:
Thermal evaporation (metals)
Organic thermal evaporation
E-beam evaporation
Magnetron sputtering (functioning as a hybrid growth system)
Available Deposition Methods:
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Electron beam (e-beam) evaporation
Magnetron sputtering (metals, oxides, nitrides, insulators)
System Configuration:
Ranges from manual thermal evaporation to fully automated process control with multiple growth recipes
Optional fast-entry load lock chamber available when needed
Top-mounted sample stage accommodates substrates up to 11 inches in diameter
Available options:
Substrate heating
Rotation
Bias voltage
Z-shift adjustment
Configurable with:
Planetary sample stage
Source shutters
Substrate shutters
**Glovebox-Compatible Thin Film Deposition System**
**System Overview:**
This floor-standing PVD system was specifically developed for glovebox integration, enabling the deposition of air-sensitive thin films. The high-chamber design is ideal for high-performance evaporation processes while maintaining compatibility with magnetron sputtering deposition.
**Key Features:**
- Designed for deposition of metals, dielectrics, and organic materials
- Features a stainless steel box-style vacuum chamber with:
- Dual-door design (front and rear) for glovebox integration
- Operation access via either the glovebox-connected front door or external rear door
- Optimized chamber geometry with high aspect ratio:
- Ideal for long working distance evaporation with superior coating uniformity
- Compatible with magnetron sputtering configuration
- Base vacuum pressure <5×10 mbar
- Flexible configuration options to meet varying budgets and requirements
- Scalable from manual thermal evaporation to fully automated process control with multiple growth recipes
**Deposition Capabilities:**
- Thermal evaporation (metals)
- Low-temperature thermal evaporation (organics)
- Electron beam (e-beam) evaporation
- Magnetron sputtering (metals, oxides, nitrides, insulators)
**Technical Highlights:**
1. The high aspect ratio chamber design provides optimal geometry for both:
- Evaporation processes requiring long throw distances
- Sputtering applications when configured accordingly
2. Dual-door access enables:
- Glovebox integration through front door
- Conventional loading via rear door
3. System maintains ultra-high vacuum compatibility while offering exceptional configuration flexibility
**Modular Pilot-Scale Vacuum Coating System**
**System Concept:**
This system introduces modular design principles to pilot-scale production, featuring:
- Large chamber volume enabling:
- Upscaling of component sizes
- Accommodation of large-area coating requirements
- Integrated fast-entry load lock chamber for enhanced sample throughput
- Fully customizable configuration to meet specific coating requirements
**Technical Specifications:**
- Floor-standing vacuum deposition system for metals, dielectrics, and organic thin films
- Stainless steel box-style chamber with front access door for sample handling
- Large chamber volume supports:
- Pilot-scale coating applications
- Complex experimental configurations
- Compatibility with all major deposition components and custom fixtures
- Base vacuum pressure ≤5×10 mbar
- Flexible configuration options tailored to:
- User budgets
- Specific application requirements
**Available Deposition Methods:**
- Thermal evaporation (metals)
- Low-temperature thermal evaporation (organics)
- Electron beam (e-beam) evaporation
- Magnetron sputtering (metals, oxides, nitrides, insulators)
**Key Advantages:**
1. Modular architecture enables:
- Easy component upgrades
- Process scalability
2. Large chamber dimensions facilitate:
- Multiple source configurations
- Uniform large-area deposition
3. Customizable design supports:
- Research and development needs
- Small-batch production requirements
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