Customization: | Available |
---|---|
After-sales Service: | on-Line Service |
Warranty: | One Year |
Suppliers with verified business licenses
Carbon black
Carbon nanotubes
Catalyst powders
Mica powder
Silicon dioxide (SiO)
Polymer powders
Surface Modification: High-energy particles in the plasma bombard powder surfaces, altering surface morphology and introducing active functional groups.
Impurity Removal: Plasma treatment eliminates surface-adsorbed contaminants.
Performance Enhancement: Improves powder properties such as:
Hydrophilicity
Dispersibility
Compatibility
Flowability
Catalytic activity
Dynamic Processing: Unique rotating drum design ensures powders tumble continuously for uniform plasma exposure (vs. static treatment in conventional systems).
Precision Control: Adjustable rotation speed optimizes process parameters for chemical modification.
Dry Process: No solvent residues (unlike wet chemical methods), making it energy-efficient and eco-friendly.
Overcomes Limitations of Static Treatment:
Traditional methods struggle with uniform modification beyond 10-nm surface layers due to powder stacking.
The rotating system ensures full particle exposure, even for high-surface-area nanomaterials.
Preserves Core Properties: Modifies surface physicochemical structure without compromising intrinsic particle performance.
Operates under low-pressure conditions in a sealed chamber to maintain plasma stability.
Ideal for R&D and industrial-scale powder functionalization.
Product Specifications
Parameter | Details |
---|---|
Model | NE-PE05X |
Power | 0-300W (adjustable) |
Plasma Generator Frequency | 40KHz |
Chamber Material | 316 Stainless Steel |
Chamber Dimensions | Φ164 × D270mm |
Material Bottle Size | Φ76 × D225mm |
Vacuum Degree | <100Pa |
Gas Flow Controller | 0-500 SCCM |
Gas Channels | 2 (Oxygen, Argon, etc.) |
Control System | 4.3-inch Touch Screen + PLC |
Power Supply | 220V |
Overall Dimensions | L514 × W99 × H452mm |
This system includes:
Vacuum chamber
RF generator
Vacuum pump
Gas inlet/outlet ports
Capacitively Coupled External Electrode Design
Processor: Cylindrical quartz glass chamber
Eliminates electrode corrosion & reactant deposition issues
Plasma Discharge System
200W high-frequency oscillator (13.56MHz)
Integrated impedance matcher between power supply and electrodes
Plasma Technology
Utilizes low-temperature plasma to:
Chemically/physically clean surfaces
Enhance wettability
Implant new functional groups
Perform surface etching
Parameter | Details |
---|---|
Model | NE-Q05H |
Frequency | RF 13.56 MHz (Solid-State RF Power) |
Power | 200W |
Chamber Material | Quartz Heat-Resistant Glass |
Chamber Volume | 5L |
Chamber Dimensions (Cylindrical) | Φ150 × 280mm (D) |
Gas Flow Controller | MFC (Mass Flow Controller), 0-300 sccm |
Gas Channels | 2 (Supports O, H, etc. For special gases, notify in advance) |
Vacuum Measurement System | Pirani Gauge |
Ultimate Vacuum | 1Pa |
Control Method | PLC + 4.3-inch Touch Screen |
Power Supply | 220V |
Overall Dimensions | 548mm (D) × 588mm (W) × 617mm (H) |
Product Overview: Oxygen Plasma Cleaner
An oxygen plasma cleaner is a surface cleaning and hydrophilic treatment device. It generates high-energy oxygen plasma by applying RF power to oxygen gas within a vacuum chamber. The activated plasma effectively cleans and modifies surfaces.
Surface cleaning & activation
Gold coating pretreatment
Photoresist removal
Metal oxide reduction
Mild etching
Organic contaminant removal
Hydrophilic modification experiments
Pre-coating/pre-treatment for films & coatings
Chemical-Free Process
Maintenance-free operation
No consumables required
Surface Functionalization
Introduces oxygen-containing groups:
Hydroxyl (-OH)
Carboxyl (-COOH)
Carbonyl (-C=O)
Enhances surface polarity & hydrophilicity
Oxygen plasma breaks down contaminants
Reactive species graft polar functional groups
Non-thermal process preserves bulk material properties
Product Specifications
Parameter | Details |
---|---|
Model | NE-OP2OF |
Power | 0-300W (adjustable) |
Frequency | RF 13.56MHz |
Chamber Material | 316 Stainless Steel |
Chamber Dimensions | 380(L) × 375(D) × 160(H) mm |
Chamber Volume | 22.8L |
Max. Sample Size | 300 × 300mm |
Ultimate Vacuum | 1Pa |
Control Method | 4.3-inch Touch Screen + PLC |
Gas Channels | 2 (Oxygen, etc.) |
Overall Dimensions | 650(L) × 575(W) × 635(H) mm |
Input Voltage | 220V |
Technology
ICP (Inductively Coupled Plasma) with External Electrodes
High plasma density
Electrode-free chamber design prevents sputtering contamination
High-Purity Quartz Glass Vacuum Chamber
Chemically inert & easy to clean
Surface Modification
Enhances:
Adhesion
Compatibility
Wettability
Sterilization
Effective disinfection & bactericidal treatment
Widely used in:
Optics & Optoelectronics
Electronics
Materials Science
Life Sciences
Polymer Engineering
Biomedical Research
Microfluidics
Product Specifications
Parameter | Details |
---|---|
Model | NE-Q05 |
Frequency | RF 13.56 MHz (Solid-State RF Power) |
Power | 0-200W (Adjustable) |
Chamber Material | Quartz Heat-Resistant Glass |
Chamber Volume | 5L |
Chamber Dimensions (Cylindrical) | Φ150 × 280mm (D) |
Touch Screen | 4.3-inch |
Ultimate Vacuum | 1Pa |
Control Method | PLC + Touch Screen |
Gas Channels (Standard) | 2 (Supports O, Ar, N, H, etc.) |
Overall Dimensions | 510mm (L) × 480mm (W) × 540mm (H) |
Vacuum system
Vacuum chamber
Gas circulation system
Power control system
Computerized control unit
Multi-layer Processing Electrodes
Maximizes chamber utilization efficiency
Accommodates diverse cleaning requirements
Plasma Fundamentals
Plasma represents the fourth state of matter (alongside solids, liquids, and gases)
Generated when ionizing energy is applied to gas, producing:
Ions
Electrons
Excited nuclei
Reactive radicals
Photons
Cleaning Mechanism
High-energy plasma activates surfaces through:
Physical bombardment
Chemical reactions
Achieves dry-state processing with superior efficiency
Dry processing: No liquid residues
High effectiveness: Nanoscale cleaning capability
Energy-efficient: Lower operational costs than wet cleaning
Product Specifications
Parameter | Details |
---|---|
Model | NE-PE10F |
Plasma Frequency | RF 13.56MHz (Auto Impedance Matching) |
Ultimate Vacuum | 1Pa |
Power | 0-300W (Adjustable) |
Chamber Dimensions | 230(L) × 270(D) × 175(H) mm |
Chamber Volume | 10L |
Single-Layer Effective Processing Area | 208(L) × 215(D) mm |
Processing Layers | 3 |
Electrode Spacing | 55mm |
Chamber Material | 316 Stainless Steel |
Gas Channels | 2 (Supports O, Ar, N, H, etc.) |
Touch Screen | 4.3-inch |
Control Method | PLC + Touch Screen |
Power Supply | 220V |
Overall Dimensions | 600(L) × 600(W) × 550(H) mm |
Product Overview: NE-PE05F Compact RF Plasma Cleaner
The NE-PE05F utilizes high-frequency alternating electric fields in a vacuum environment to generate plasma. This induces complex physicochemical reactions that:
Remove surface contaminants
Enhance material adhesion and wettability
Prepare surfaces for subsequent processing steps
RF Plasma Technology (13.56MHz standard)
Compact design for lab/bench-top use
Dry cleaning process (no solvents or abrasives)
Pre-treatment for:
Coating
Bonding
Printing
Removal of:
Organic residues
Oxide layers
Micro-particulates
Parameter | Details |
---|---|
Model | NE-PE05F |
Plasma Frequency | RF 13.56MHz (Auto Impedance Matching) |
Ultimate Vacuum | 1Pa |
Power | 0-200W (Adjustable) |
Chamber Dimensions (Cylindrical) | Φ140 × 270mm (D) |
Chamber Volume | 5L |
Effective Processing Area | 130(W) × 245(D) mm |
Chamber Material | 316 Stainless Steel |
Gas Channels | 2 (O, H, N, etc.) |
Touch Screen | 4.3-inch |
Control Method | PLC + Touch Screen |
Power Supply | 220V |
Overall Dimensions | 550(L) × 460(W) × 520(H) mm |