10L Plasma Cleaning System (500W/1000W RF Power)
(Advanced Surface Treatment for Precision Cleaning & Activation)
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Key Specifications
Component Parameters
Cleaning Chamber - Material: High-purity quartz
- Dimensions: Ø200mm × 340mm
RF Power Supply - Type: Solid-state RF generator (13.56MHz ±0.005%)
- Power range: 0-500W or 0-1000W (continuously adjustable)
- Efficiency: ≥75%, harmonic distortion ≤-50 dBc
- Cooling: Forced air
Gas System - Channels: 2 (A: 10-100ml/min; B: 16-160ml/min)
- Flow control: Float flowmeter
Vacuum System - Pump: Dual-stage rotary vane pump
- Speed: 240L/min (50Hz), 288L/min (60Hz)
- Base pressure: 0.5Pa (ultimate), working pressure ≤40Pa
- Ports: KF16 (inlet/outlet)
General - Power: AC 220V, 50/60Hz; 1000W/1500W total
- Dimensions: 600×650×730mm, 80kg (packaged)
- Operating temp: -10°C to 40°C
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Core Features
1. Precision RF Power
o Stable output (±0.1% power stability) with reflection protection (≤100W).
o N-type RF connector for low signal loss.
2. Efficient Processing
o Dual gas channels enable reactive gas mixing (e.g., /Ar for oxide removal).
o Quartz chamber resists chemical corrosion and allows visual monitoring.
3. Industrial-Grade Vacuum
o Fast pump-down with low-noise operation (≤56dB).
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Plasma Cleaning Applications
• Electronics: PCB cleaning, chip packaging, solderability enhancement.
• Optics: Lens/ATR element degreasing, anti-reflection coating prep.
• Medical: Implant sterilization, biomaterial surface activation.
• Materials Science: Polymer hydrophilicity modification, adhesive bonding improvement.
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Technical Advantages
Surface Modification: Removes nanoscale contaminants while functionalizing surfaces (e.g., -OH group formation).
Eco-Friendly: No chemical waste vs. wet cleaning.
Versatile: Compatible with metals, ceramics, polymers, and composites.
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*Note: System excludes gas cylinders. For OEM requests (e.g., 4-channel gas systems), contact our engineering team.*
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