| Customization: | Available |
|---|---|
| After-sales Service: | on-Line Service |
| Warranty: | One Year |
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This user-friendly system stands out with an innovative design including a convenient "flip-top" vacuum chamber that ensures effortless operation, making it ideal for thermal evaporation and sputter deposition of a diverse range of materials including metals, dielectrics, and organics.
Integrated design featuring a vacuum chamber strategically recessed into the support frame for stability and efficiency.
Chamber options: Choose between a Flip-top lid or an elegant bell-jar configuration.
Multi-deposition technologies:
Thermal evaporation (ideal for metals & organics)
Low-temperature evaporation (suitable for delicate organic films)
Magnetron sputtering (perfect for metals, oxides, nitrides, and insulators)
Deposition source layout: Innovative design with sources mounted at the bottom, while substrates are placed at the top (accommodates wafers up to 6 inches in diameter).
Substrate handling: Features heating, rotation, and Z-shift adjustment options for precise control.
Glovebox-compatible: Engineered for flawless integration with existing glovebox systems.
Thermal evaporation (optimal for metals)
Low-temperature thermal evaporation (tailored for organics)
Magnetron sputtering (versatile for metals, oxides, nitrides, insulators)
Vacuum Coating System Description (English Version):
This well-regarded system serves as a premier universal platform within our coating series, boasting a front-opening box-style chamber that is perfectly suited for multi-source magnetron sputtering, along with thermal evaporation and sophisticated electron beam evaporation.
Integrated design showcasing a vacuum chamber mounted directly on the control system's electronics cabinet for streamlined functionality.
Multi-deposition technologies supported:
Thermal evaporation & low-temperature evaporation (perfect for both metallic and organic materials)
Magnetron sputtering (suitable for metals, oxides, nitrides, and insulators)
E-beam evaporation (compatible with a wide range of materials except organics)
Flexible source configuration:
Deposition sources (thermal, e-beam) are generally installed at the bottom.
Elevate your deposition technology with our versatile sputtering sources, which can be strategically positioned at the top when necessary, ensuring adaptability for your specific requirements.
Our substrate handling system:
is engineered to accommodate wafer sizes up to an impressive 11 inchesin diameter.
Our customizable options include advanced features like heating, rotation, bias voltage, and precise Z-shift adjustmentsto meet all your deposition needs.
Flexibility is key, with configurations available featuring planetary sample stages, source shutters, and substrate shuttersto enhance process efficiency.
Explore our automation options,:
spanning from manual thermal evaporation all the way to state-of-the-art fully automated process controlfor seamless operation.
Consider our fast-loading chamber to expedite sample exchange times, enhancing your throughput.
Thermal evaporation (ideal for metals)
Low-temperature thermal evaporation (suitable for organics)
Electron beam (e-beam) evaporation
and Magnetron sputtering (metals, oxides, nitrides, insulators)
Discover our High-Volume Vacuum Coating System,
boasting key features such as:
A tall-chamber design meticulously optimized for thermal evaporation, low-temperature thermal evaporation, and e-beam evaporation, with an extended working distance ensuring superior film uniformity
A vacuum chamber integrated directly onto the control system electronics cabinet
Perfect for evaporation techniques that necessitate longer working distances to achieve peak uniformity
A near-90° evaporation incidence angle enabling outstanding lift-off performance for photolithographic devices
Our system supports versatile multi-process deposition:
including Thermal evaporation (metals)
Organic thermal evaporation
E-beam evaporation
and Magnetron sputtering (acting as a hybrid growth system)
Choose from our available deposition methods:
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Electron beam (e-beam) evaporation
and Magnetron sputtering (metals, oxides, nitrides, insulators)
Our system configuration offers:
a range from manual thermal evaporation to fully automated process control that incorporates multiple growth recipes for unparalleled flexibility
Consider our optional fast-entry load lock chamber, available to meet your operational needs.
The top-mounted sample stage is designed to handle substrates up to 11 inches in diameter, accommodating larger scale projects.
Explore a range of tailored options designed to enhance your deposition system experience:
Substrate Heating: Achieve precise thermal management for optimal film growth.
Rotation: Ensure uniform deposition with advanced rotational capabilities.
Bias Voltage: Fine-tune your processes with adjustable bias voltage settings.
Z-Shift Adjustment: Customize the working distance easily with Z-shift control.
Configure your system with state-of-the-art features including:
Planetary Sample Stage: Maximize coating uniformity through planetary motion.
Source Shutters: Protect targets with precision-engineered source shutters.
Substrate Shutters: Maintain cleanliness with dedicated substrate shutters.
**Glovebox-Compatible Thin Film Deposition System**
**System Overview:**
This robust, floor-standing PVD system is meticulously crafted for seamless glovebox integration. It expertly deposits air-sensitive thin films, supported by a high-chamber design that excels in high-performance evaporation, while being perfectly aligned with magnetron sputtering capabilities.
**Key Features:**
- Tailored for exceptional deposition of metals, dielectrics, and organic materials
- Incorporates a durable stainless steel, box-style vacuum chamber featuring:
- A dual-door design for effortless glovebox integration, offering:
- Easy operation via glovebox-connected front door or external rear access
- Optimized chamber geometry with an impressive high aspect ratio:
- Perfect for achieving superior coating uniformity over long working distances
- Seamlessly compatible with a magnetron sputtering configuration
- Attains a base vacuum pressure <5×10 mbar for high-precision processes
- Offers flexible configuration options to suit varying budgetary and operational needs
- Adaptable from manual thermal evaporation to a fully automated system with multiple growth recipes for diverse applications
**Deposition Capabilities:**
- High-efficiency thermal evaporation for metals
- Low-temperature thermal evaporation specifically for organic materials
- Advanced electron beam (e-beam) evaporation
- Versatile magnetron sputtering for metals, oxides, nitrides, and insulators
**Technical Highlights:**
1. The chamber's high aspect ratio design is meticulously optimized for:
- Processes demanding extended throw distances in evaporation
- Specialized sputtering applications when correctly configured
2. Experience dual-door access for maximum operational flexibility:
- Front door seamlessly integrates with glovebox systems
- Rear door facilitates conventional sample loading and unloading
3. The system excels in maintaining ultra-high vacuum capabilities while offering unmatched configuration flexibility
**Modular Pilot-Scale Vacuum Coating System**
**System Concept:**
Introducing a groundbreaking system that employs modular design principles for pilot-scale production, featuring:
- A spacious chamber volume designed to:
- Support the upscaling of component sizes effortlessly
- Accommodate extensive large-area coating demands
- An integrated fast-entry load lock chamber boosting sample throughput efficiency
- A fully customizable setup to meet unique coating specifications
**Technical Specifications:**
- A floor-standing vacuum deposition powerhouse designed for metals, dielectrics, and organic thin films
- Equipped with a sturdy stainless steel, box-style chamber, featuring a front access door for streamlined sample management
- Generous chamber volume supports:
- Pilot-scale coating applications with ease
- Facilitating complex experimental setups
- Seamless compatibility with all major deposition components and bespoke fixtures
- Achieves base vacuum pressure ≤5×10 mbar for unparalleled precision
- Provides flexible configuration options tailored especially for:
- Aligning with user budget considerations
- Catering to specific application needs and requirements
**Available Deposition Methods:**
- Thermal evaporation (metals): Achieve precision and reliability in metal coatings with our advanced thermal evaporation techniques.
- Low-temperature thermal evaporation (organics): Perfect for delicate organic materials, ensuring effective deposition at minimal thermal impact.
- Electron beam (e-beam) evaporation: Harness the power of electron beams for superior material deposition with unparalleled accuracy and efficiency.
- Magnetron sputtering (metals, oxides, nitrides, insulators): Experience exceptional versatility and quality with our magnetron sputtering, perfect for a wide range of materials.
**Key Advantages:**
1. Modular architecture enables:
- Easy component upgrades: Seamlessly enhance system capabilities with our user-friendly modular designs.
- Process scalability: Easily adapt and expand your operations to meet growing demands without compromising quality.
2. Large chamber dimensions facilitate:
- Multiple source configurations: Customize your setup to achieve optimal results across diverse applications.
- Uniform large-area deposition: Achieve consistent and even coatings over expansive surfaces with ease.
3. Customizable design supports:
- Research and development needs: Tailor our solutions to meet the unique challenges of your R&D projects.
- Small-batch production requirements: Efficiently produce limited runs without sacrificing precision or quality.
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