Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine

Product Details
Customization: Available
Blade Type: Diamond Wire Saw
Manufacturing Process: Cutting
Diamond Member Since 2025

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Year of Establishment
2025-04-22
Registered Capital
1.48 Million USD
  • Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine
  • Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine
  • Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine
  • Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine
  • Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine
  • Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine
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Basic Info.

Model NO.
RJ-DWC150D
Application
Laboratory Material Cutting
Condition
New
Max Cutting Size
Ø150mm × 150mm (6")
Wire Diameter
≤0.45mm (Options: 0.125-0.42mm)
Wire Speed
0-4m/S Adjustable
Transport Package
Wooden Case
Specification
Customized
Trademark
RJ
Origin
Zhengzhou, China

Product Description

1. Equipment Name & Model
  • Fully Automatic Diamond Wire Saw
    Model: RJ-DWC150-A
    Type: Continuous Cutting System
2. Core Technology & Features
  • Diamond Wire Cutting Technology
    • Motion Mode: Single Wire Reciprocating Motion
    • Wire Length: ≤270m
    • Tension System: Pneumatic Tensioning System (0-1MPa adjustable)
  • Precision Control
    • Dimensional Accuracy: ±10μm
    • Axis Control: Y/Z/R-axis Stepper Motors
    • Worktable Rotation: 360° Programmable Rotation
3. Compatible Materials
  • Ceramics: Alumina/Zirconia, Semiconductor Ceramics
  • Crystals: Sapphire, Silicon, SiC, CsI
  • Glass: Optical/Quartz, Chalcogenide
  • Metals: Ti/Fe/Al Alloys, Ferrite
  • Biomedical: Tissue Specimens, Bone-Implant Samples
  • Others: Thermoelectric , IR Optical (ZnSe)
4. Technical Specifications
Parameter Specification
Max Cutting Size Ø150mm × 150mm (6")
Wire Diameter ≤0.45mm (options: 0.125-0.42mm)
Wire Speed 0-4m/s adjustable
Power Supply 220V 50Hz, <550W
Dimensions 600×600×1100mm
Weight ~500kg
5. Key Components
  • Standard Accessories:
    • Tension Wheels (2 pcs)
    • Guide Wheels (2 pcs)
    • Diamond Wire (2 rolls)
    • Cooling Pump (1 unit)
  • Optional Accessories:
    • Swing Mechanism (for hard materials)
    • Heating Stage
    • DX-100 Single Crystal Orientator
6. Applications
  • Semiconductor: Wafer dicing
  • Gem Processing: Jade/Sapphire cutting
  • Research: Geological sample preparation
7. Key Advantages
  • High Efficiency: Long-life diamond wire (≤270m)
  • Precision: ±10μm tolerance, digital axis control
  • Versatility: Cuts hard/brittle materials and soft tissues
Versatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting MachineVersatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting MachineVersatile Diamond Wire Cutting Equipment for Enhanced Performance Cutting Machine

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