| Customization: | Available |
|---|---|
| After-sales Service: | on-Line Service |
| Warranty: | One Year |
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This intuitive, user-friendly system boasts a revolutionary design featuring a convenient "flip-top" vacuum chamber, ensuring effortless operation, perfect for conducting advanced thermal evaporation and sputter deposition of a wide range of metals, dielectrics, and organic materials.
Ingenious integrated design with a vacuum chamber partially recessed into the support frame for compactness.
Versatile chamber options: Choose between a flip-top lid or a classic bell-jar configuration.
Adaptable multi-deposition technologies:
Advanced Thermal evaporation (ideal for metals & organics)
Low-temperature evaporation ease (perfect for organic films)
Efficient Magnetron sputtering (perfect for metals, oxides, nitrides, and insulators)
Strategically designed deposition source layout: With sources expertly mounted at the bottom, and substrates positioned at the top (capable of supporting wafers up to an impressive 6 inches in diameter).
Innovative substrate handling system: Offering heating, rotation, and Z-shift adjustments for optimal results.
Seamless glovebox compatibility: Elegantly designed for flawless integration with existing glovebox systems.
Thermal evaporation (perfect for metals)
Low-temperature thermal evaporation (ideal for organics)
Cutting-edge Magnetron sputtering (for metals, oxides, nitrides, insulators)
Vacuum Coating System: An Overview (English Version):
Our system is celebrated as a universal favorite within our coating series, featuring a convenient front-opening box-style chamber perfectly tailored for multi-source magnetron sputtering, alongside thermal evaporation and precision electron beam evaporation.
Ingenious integrated design with the vacuum chamber smartly mounted directly on the control system's electronics cabinet.
Supports a range of multi-deposition technologies:
Thermal evaporation & low-temperature evaporation (for both metals and organic materials)
Highly effective Magnetron sputtering (covering metals, oxides, nitrides, and insulators)
Advanced E-beam evaporation (compatible with most materials, excluding organics)
Flexible and efficient source configuration:
Deposition sources, including thermal and e-beam, are typically installed at the bottom.
Our sputtering sources can be precisely positioned to cater to your specific needs, offering incredible versatility. Positioned at the top based on your precise requirements.
Substrate Handling Excellence:
Designed to accommodate wafer sizes seamlessly, supporting up to 11 inchesfor maximum compatibility.
Enhance your process with options like sophisticated heating, precise rotation, customizable bias voltage, and adaptable Z-shift adjustmentto suit your every need.
Our system is configurable with advanced planetary sample stages, reliable source shutters, and efficient substrate shuttersfor tailored solutions.
Automation Options for Seamless Operation:
Our automation spans the spectrum from manual thermal evaporation right through to a fully automated process controlensuring precision and efficiency.
Additionally, we offer an optional fast-loading chamber to facilitate rapid sample exchange, saving precious time.
Thermal evaporation for metals
Low-temperature thermal evaporation ideal for organics
Electron beam (e-beam) evaporation
and Magnetron sputtering for metals, oxides, nitrides, and insulators
High-Volume Vacuum Coating System for Demanding Applications
Key Features That Set Us Apart:
Innovative Tall-chamber Design specifically optimized for various evaporation techniques, featuring an extended working distance for unparalleled film uniformity
The vacuum chamber is integrated directly on the control system electronics cabinet
making it ideal for techniques that require longer working distances for optimal uniformity
Achieve excellent lift-off performance with near-90° evaporation incidence angle, perfect for photolithographic devices
Supports multi-process deposition technology:
Thermal evaporation
Organic thermal evaporation
E-beam evaporation,
and Magnetron sputtering (serving as a hybrid growth system)
Explore Our Comprehensive Deposition Methods:
Thermal evaporation for metals
Low-temperature thermal evaporation for organics
Electron beam (e-beam) evaporation
Magnetron sputtering for metals, oxides, nitrides, and insulators
System Configuration Options:
Flexibility ranges from manual thermal evaporation to fully automated process control enhanced with multiple growth recipes for versatility
An optional fast-entry load lock chamber is available to meet your specific needs
Top-mounted sample stage that elegantly accommodates substrates up to 11 inches in diameter, providing extensive adaptability
Tailor your system with available options such as:
Substrate heating for enhanced processing
Rotation
Bias voltage
Z-shift adjustment
Configurable with:
Planetary sample stage
Source shutters
Substrate shutters
**Glovebox-Compatible Thin Film Deposition System**
**System Overview:**
Our state-of-the-art, floor-standing PVD system has been meticulously crafted for seamless glovebox integration. This feature empowers the deposition of air-sensitive thin films with unparalleled efficiency. The advanced high-chamber design is perfectly suited for high-performance evaporation processes while ensuring magnetron sputtering deposition compatibility.
**Key Features:**
- Expertly designed for depositing a diverse range of materials, including metals, dielectrics, and organics
- Equipped with a robust stainless steel box-style vacuum chamber that includes:
- A strategic dual-door design (front and rear) tailored for glovebox integration
- Easy operation access through either the glovebox-connected front door or the external rear door
- Chamber geometry optimized with a high aspect ratio, offering:
- Superior coating uniformity ideal for long working distance evaporation
- Compatibility with advanced magnetron sputtering configurations
- Achieves a base vacuum pressure of <5×10 mbar, ensuring optimal performance
- Offers flexible configuration options, adaptable to a variety of budgets and specific needs
- Scalable from manual thermal evaporation to sophisticated automated process control with multiple growth recipes
**Deposition Capabilities:**
- Thermal evaporation for precise metal layer deposition
- Low-temperature thermal evaporation ideal for delicate organics
- Precision electron beam (e-beam) evaporation
- Magnetron sputtering suitable for metals, oxides, nitrides, and insulators
**Technical Highlights:**
1. The high aspect ratio chamber design offers optimal geometry for:
- Evaporation processes demanding long throw distances, ensuring precision
- Sputtering applications when configured for specific tasks
2. Dual-door access provides:
- Smooth glovebox integration through the front door
- Conventional loading convenience via the rear door
3. The system delivers ultra-high vacuum compatibility, coupled with exceptional configuration flexibility to meet the most demanding requirements
**Modular Pilot-Scale Vacuum Coating System**
**System Concept:**
Embracing the future of modular design in pilot-scale production, this system offers:
- A spacious chamber volume for:
- Seamless upscaling of component sizes, broadening operational capacity
- Fulfillment of large-area coating requirements with ease
- An integrated fast-entry load lock chamber that significantly enhances sample throughput
- A fully customizable configuration crafted to meet diverse coating specifications
**Technical Specifications:**
- This floor-standing vacuum deposition system is tailored for metals, dielectrics, and organic thin films
- Features a durable stainless steel box-style chamber with front access door for efficient sample handling
- The large chamber volume adeptly supports:
- Pilot-scale coating applications that require versatility
- Complex experimental configurations for advanced research
- Compatibility with all major deposition components and custom fixtures, elevating operational flexibility
- Achieves a base vacuum pressure of ≤5×10 mbar for maximum precision
- Offers flexible configuration options, precisely tailored to:
- Accommodate varying user budgets
- Address specific application requirements with precision
**Available Deposition Methods:**
- Thermal evaporation meticulously optimized for metals
- Experience unparalleled innovation with our state-of-the-art low-temperature thermal evaporation technology, meticulously designed for processing organic materials with utmost precision and efficiency.
- Discover the power of electron beam (e-beam) evaporation, a cutting-edge technique that ensures superior deposition quality, meeting the high standards of modern material engineering.
- Unlock the potential of diverse material applications with magnetron sputtering, expertly crafted for metals, oxides, nitrides, and insulators, ensuring versatile solutions for your complex needs.
**Key Advantages:**
1. Harness the power of our modular architecture that offers:
- Effortless component upgrades, paving the way for seamless incorporation of the latest advancements into your processes.
- Unmatched process scalability, allowing you to adapt and grow in response to evolving demands and new opportunities.
2. Benefit from expansive chamber dimensions that provide:
- Flexible multiple source configurations, enabling customized setups tailored to your specific operational needs.
- Consistent and uniform large-area deposition, ensuring high-quality outcomes for extensive applications.
3. Embrace a fully customizable design that caters to:
- The dynamic and evolving needs of research and development, fostering innovation and discovery.
- The unique requirements of small-batch production, offering precise and efficient solutions tailored to niche markets.
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