Multi-Zone Tubular Furnace

• Customization: Available
• After-sales Service: on-Line Service
• Warranty: One Year
• Model NO.: RJ-T1150-50
• Application: Industry, School, Hospital, Lab
• Customized: Customized
• Certification: CE
• Structure: Portable
• Material: Steel
• Type: Tubular Furnace
• Transport Package: Wooden Case
• Specification: Customized
• Trademark: RJ
• Origin: Zhengzhou, China

Product Description

Multi-Zone Tubular Furnace
The Multi-Zone Tubular Furnace offers flexible gas and vacuum system configurations, making it ideal for thin-film deposition in semiconductor industries, large-area insulating materials, and metal/alloy coatings. NBD's integrated CVD coating systems are widely used in university labs, research institutes, and environmental science applications.

 

Key Features

1. High-Performance Tubes: High-purity quartz or stainless steel tubes with superior corrosion/heat resistance.
2. Energy Efficiency: Al2O3 fiber insulation minimizes heat loss and power consumption.
3. Advanced Cooling: Double-layer air-cooled furnace body with automatic lift-up lid.
4. Programmable Profiles:
   • Pre-stores multiple sintering curves with dynamic real-time display.
   • Supports unattended sintering via scheduled operation.
5. Data Logging: Real-time monitoring of power/voltage/temperature, with exportable records.
6. Remote Control: Operate and monitor equipment status remotely.
7. Temperature Calibration: Non-linear correction between setpoint and sample temperature.
8. Integrated Systems: Multi-zone heating, multi-gas supply, and high-vacuum options.

 

Technical Specifications

Category	Parameters
Temperature Zones	3-Zone / 4-Zone / 5-Zone / 6-Zone (customizable)
Tube Sizes	Ø25/50/60/80/100 mm × 1600 mm
Max. Temperature	≤1150°C
Heating Zone Layout	Customizable (e.g., 200×3, 300+400+300 mm, etc.)
Heating Rate	≤20°C/s
Power Supply	AC 380V, 6-18 kW (varies by zone count)

 

Gas System (Optional)

• Flow Control: Rotameter or mass flow controller (MFC).
• Gas Inlets: 2/3/4 ports (selectable).
• Flow Range: 20-800 mL/min or 50-500 sccm (multi-range options).
• Pressure Range: 0-0.15 MPa.

 

Vacuum Systems
Low Vacuum (Optional)

• Pump Model: RJ-3C / NBD-4C.
• Pumping Speed: 3-4 L/s.
• Port Size: KF16/25.
• Base Pressure: 3-5 Pa (ultimate: 6.2e-2 Pa).

High Vacuum (Optional)

• Pump Model: RJ-103(A/B).
• Pumping Speed: 110 L/s (A) or 600 L/s (B).
• Vacuum Gauge: Compound gauge.
• Base Pressure: 4.3e-3 Pa (A) or 6e-4 Pa (B).

 

Applications

• Semiconductor: Deposition of dielectric/metallic films.
• Research: CVD, annealing, sintering.
• Custom Workflows: Multi-zone gradients for specialized processes.