| Customization: | Available |
|---|---|
| After-sales Service: | on-Line Service |
| Warranty: | One Year |
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Engineered for ease, this user-friendly system features a cutting-edge design that streamlines your operations. The revolutionary "flip-top" vacuum chamber ensures effortless operation, making it perfectly suitable for both thermal evaporation and sputter deposition processes, capable of handling metals, dielectrics, and organic materials with unmatched precision.
Innovative integrated design featuring a vacuum chamber that is partially recessed into a robust support frame for stability and space efficiency.
Chamber options available: Choose between a convenient flip-top lid or a classic bell-jar configuration to suit your needs.
Diverse multi-deposition technologies:
Thermal evaporation (for metals and organic materials), offering versatility across applications.
State-of-the-art low-temperature evaporation (ideal for organic films), ensuring delicate handling of sensitive materials.
Advanced magnetron sputtering (suitable for metals, oxides, nitrides, and insulators), delivering high-quality coatings.
Optimized deposition source layout: Strategic placement with sources mounted at the bottom, while substrates are positioned at the top (accommodates wafers up to 6 inches in diameter), maximizing coating efficiency.
Enhanced substrate handling capabilities: Featuring precise heating, rotation, and Z-shift adjustment for optimal material deposition.
Glovebox-compatible design: Seamlessly integrates with existing glovebox systems for a contamination-free environment.
Thermal evaporation (for metals), providing reliable and consistent results.
Innovative low-temperature thermal evaporation (for organics), protecting the integrity of sensitive materials.
Expert magnetron sputtering (for metals, oxides, nitrides, insulators), facilitating superior layer uniformity.
Vacuum Coating System Description (English Version):
Our system is a beloved universal platform within our coating series, renowned for its ingenious front-opening box-style chamber tailored for high-efficiency multi-source magnetron sputtering, along with versatile thermal evaporation and cutting-edge electron beam evaporation.
Seamless integrated design with the vacuum chamber expertly mounted directly on the control system's electronics cabinet for enhanced operational synergy.
Comprehensive support for multi-deposition technologies:
Efficient thermal evaporation & innovative low-temperature evaporation (for a range of metals and organic materials)
Sophisticated magnetron sputtering (accommodates metals, oxides, nitrides, and insulators)
Precision e-beam evaporation (suitable for most materials except organics, ensuring industry-standard quality)
Flexible source configuration:
Deposition sources (thermal, e-beam) are strategically installed at the bottom, optimizing material usage and efficiency.
Enhance the versatility of your operations with our sputtering sources, which can be precisely mounted at the top if necessary, ensuring optimal performance and adaptability.
Expertly designed substrate handling:
Our system supports wafer sizes of up to 11 inches, catering to a wide range of applications.
Available options include heating, rotation, bias voltage control, and Z-shift adjustmentfor precise, tailored substrate treatment.
Configure your system with planetary sample stages, source shutters, and substrate shuttersfor enhanced control and efficiency.
Our automation options:
Vary from manual thermal evaporation to fully automated process control, offering a seamless transition as your needs evolve.Upgrade to our
optional fast-loading chamber to ensure rapid and efficient sample exchange, minimizing downtime.
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Electron beam (e-beam) evaporation
Magnetron sputtering (metals, oxides, nitrides, insulators)
Introducing our state-of-the-art High-Volume Vacuum Coating System
Key Features that set us apart:
Innovative tall-chamber design is expertly optimized for thermal, low-temperature, and e-beam evaporation, with an extended working distance to uniformly coat films to perfection.
Seamlessly integrated vacuum chamber mounted directly on the control system electronics cabinet
makes it ideal for evaporation techniques that demand longer working distances to ensure optimal film uniformity.
A near-90° evaporation incidence angle guarantees exceptional lift-off performance, perfect for photolithographic devices.
Our system supports multi-process deposition:
Thermal evaporation (metals)
Organic thermal evaporation
E-beam evaporation
Magnetron sputtering, functioning adeptly as a hybrid growth system.
Available Deposition Methods include:
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Electron beam (e-beam) evaporation
Magnetron sputtering (metals, oxides, nitrides, insulators)
Our System Configuration is highly versatile:
Ranging from manual thermal evaporation to fully automated process control with multiple growth recipes for diverse applications. Available is an
optional fast-entry load lock chamber for your convenience, facilitating swift and efficient operations.
Our top-mounted sample stage is designed to accommodate substrates up to 11 inches in diameter, supporting expansive substrate options.
Explore our available options:
Substrate heating for enhanced operational capabilities.
Rotation
Bias voltage
Z-shift adjustment
Configurable with:
Planetary sample stage
Source shutters
Substrate shutters
**Glovebox-Compatible Thin Film Deposition System**
**System Overview:**
This innovative, floor-standing PVD system is expertly crafted for integration within gloveboxes, unlocking the potential for air-sensitive thin film deposition. Its sophisticated high-chamber design ensures peak performance for evaporation processes and seamlessly incorporates magnetron sputtering deposition techniques.
**Key Features:**
- Engineered for the deposition of a wide array of materials including metals, dielectrics, and organic substances
- Boasts a robust stainless steel box-style vacuum chamber, featuring:
- An ingenious dual-door design (front and rear) tailored for seamless glovebox integration
- Offers operational access through either the glovebox-connected front door or the external rear door
- Features an optimized chamber geometry with a high aspect ratio:
- Perfectly suited for long-distance evaporation, delivering exceptional coating uniformity
- Fully compatible with advanced magnetron sputtering configurations
- Achieves base vacuum pressures of less than <5×10 mbar
- Offers a flexible range of configuration options designed to meet diverse budgets and requirements
- Scalable system, extending from manual thermal evaporation to comprehensive automated process control with multiple growth recipes
**Deposition Capabilities:**
- High-precision thermal evaporation for metals
- Low-temperature thermal evaporation optimized for organic materials
- Advanced electron beam (e-beam) evaporation
- Magnetron sputtering adept for metals, oxides, nitrides, and insulators
**Technical Highlights:**
1. The unique high aspect ratio chamber design ensures optimal geometry for:
- Evaporation processes that demand extended throw distances
- Sputtering applications when suitably configured
2. The innovative dual-door access facilitates:
- Effortless glovebox integration through the front door
- Conventional loading via the accessible rear door
3. The system is meticulously engineered to maintain ultra-high vacuum compatibility while providing unparalleled configuration flexibility
**Modular Pilot-Scale Vacuum Coating System**
**System Concept:**
This state-of-the-art system incorporates modular design principles into pilot-scale production, offering:
- An expansive chamber volume capable of:
- Supporting the upscaling of component sizes
- Accommodating large-area coating requirements
- An integrated fast-entry load lock chamber designed for enhanced sample throughput
- A fully customizable configuration that meets specific coating requirements with precision
**Technical Specifications:**
- A robust, floor-standing vacuum deposition system designed for metals, dielectrics, and organic thin films
- Stainless steel box-style chamber equipped with a convenient front access door for efficient sample handling
- Spacious chamber volume supports:
- Pilot-scale coating applications
- Complex experimental configurations tailored to specific needs
- Ensures compatibility with all major deposition components and custom fixtures
- Achieves base vacuum pressures of ≤5×10 mbar
- Provides flexible configuration options crafted to suit:
- Varying user budgets
- Specific and demanding application requirements
**Available Deposition Methods:**
- Precision thermal evaporation for metals
- Experience outstanding efficiency with our low-temperature thermal evaporation system, ideal for processing a variety of organic materials.
- Discover the precision of electron beam (e-beam) evaporation to achieve superior material coatings with pinpoint accuracy.
- Utilize magnetron sputtering to deposit metals, oxides, nitrides, and insulators flawlessly, ensuring unrivaled quality and versatility.
**Key Advantages:**
1. Our innovative modular architecture offers unparalleled flexibility, allowing you to:
- Seamlessly upgrade components as your needs evolve and technology advances.
- Expand process capabilities for future-ready scalability and growth.
2. The spacious chamber dimensions provide the advantage of:
- Configuring multiple sources effortlessly to suit diverse applications.
- Achieving uniform large-area deposition, enhancing productivity and consistency.
3. Our customizable design is engineered to support:
- Tailoring to specific research and development ambitions, empowering innovation.
- Meeting small-batch production needs with precision and efficiency.
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