| Customization: | Available |
|---|---|
| After-sales Service: | on-Line Service |
| Warranty: | One Year |
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This user-friendly system showcases a brilliant blend of innovation and simplicity with a "flip-top" vacuum chamber designed for effortless operation, making it exceptionally suitable for both thermal evaporation and sputter deposition processes. These processes are perfect for the deposition of metals, dielectrics, and organic materials.
A sophisticated Integrated design with the vacuum chamber elegantly recessed into the support frame for a streamlined appearance.
Chamber options offered: Choose between a convenient flip-top lid or a classic bell-jar configuration.
Multi-deposition technologies available:
Thermal evaporation (ideal for metals & organics)
Low-temperature evaporation (specially designed for organic films)
Advanced Magnetron sputtering (suitable for metals, oxides, nitrides, insulators)
Innovative Deposition source layout: With sources strategically mounted at the bottomand substrates positioned at the top (capable of supporting wafers up to 6 inches in diameter).
Substrate handling features: Offers heating, rotation, and precise Z-shift adjustment facilities.
Glovebox-compatible design: Ensures seamless integration with your existing glovebox systems.
Thermal evaporation (for depositing metals)
Low-temperature thermal evaporation (ideal for organic materials)
Magnetron sputtering (extensive use for metals, oxides, nitrides, insulators)
Vacuum Coating System Description (English Version):
This system stands as a renowned universal platform within our coating series, featuring a front-opening box-style chamber that is perfectly suitable for multi-source magnetron sputtering, alongside thermal evaporation and electron beam evaporation techniques.
Ingenious Integrated design with the vacuum chamber gracefully mounted on the control system's electronics cabinet.
Multi-deposition technologies fully supported:
Thermal evaporation & specialized low-temperature evaporation (ideal for metals and organic materials)
State-of-the-art Magnetron sputtering (for metals, oxides, nitrides, and insulators)
E-beam evaporation capabilities (compatible with most materials, excluding organics)
Versatile source configuration:
The deposition sources (thermal, e-beam) are typically installed at the bottom.
Additionally, sputtering sources can also be strategically mounted at the Experience unparalleled versatility and precision with our top-tier systems. Tailored solutions to meet your exact specifications, if required.
Precision Substrate Handling:
Engineered to accommodate a wide range of wafer sizes, up to 11 inches,ensuring comprehensive substrate compatibility.
Diverse Options Include advanced heating capabilities, precise rotation control, adaptive bias voltage, and fine Z-shift adjustmentfor enhanced processing flexibility.
Seamlessly configurable with cutting-edge planetary sample stages, reliable source shutters, and efficient substrate shuttersto optimize your workflow.
State-of-the-Art Automation Options:
Available, ranging from manual thermal evaporation to comprehensive, fully automated process control,catering to diverse operational needs.
Enjoy the convenience of an optional fast-loading chamber designed for rapid sample exchange, maximizing productivity.
High-precision Thermal Evaporation (metals) for flawless, durable coatings
Innovative Low-Temperature Thermal Evaporation (organics) to preserve material integrity
Advanced Electron Beam (e-beam) Evaporation
Efficient Magnetron Sputtering (metals, oxides, nitrides, insulators) for diverse applications
Introducing Our High-Volume Vacuum Coating System
Key Features That Elevate Performance:
Innovative Tall-Chamber Design specifically optimized for thermal evaporation, low-temperature thermal evaporation, and e-beam evaporation, with extended working distance ensuring superior film uniformity
Ingeniously mounted vacuum chamber directly on the control system electronics cabinet
Perfectly suited for evaporation techniques that require longer working distances to achieve unparalleled uniformity
Near-90° evaporation incidence angle for excellent lift-off performance in photolithographic device production
Supporting Versatile Multi-Process Deposition:
Thermal evaporation (metals)
Organic thermal evaporation
E-beam evaporation
Magnetron sputtering (functioning as a hybrid growth system)
Comprehensive Deposition Methods Available:
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Electron beam (e-beam) evaporation
Magnetron sputtering (metals, oxides, nitrides, insulators)
Dynamic System Configuration:
Offering a range from manual thermal evaporation to sophisticated fully automated process control with versatile growth recipes to suit diverse production needs.
Optional Features Enhance Flexibility: A fast-entry load lock chamber is available, providing efficiency when needed.
The top-mounted sample stage can accommodate substrates up to 11 inches in diameter, maximizing operational capacity.
Additional Available Options:
Substrate heating for precise temperature control
Rotation for uniform coverage
Bias voltage for enhanced deposition quality
Z-shift adjustment for precise layer management
Configurable with:
Planetary sample stage
Source shutters
Substrate shutters
**Glovebox-Compatible Thin Film Deposition System**
**System Overview:**
This floor-standing PVD system is ingeniously crafted for seamless glovebox integration, offering a state-of-the-art solution for air-sensitive thin film deposition. The towering chamber design is meticulously optimized for superior high-performance evaporation processes while ensuring harmonized compatibility with magnetron sputtering deposition.
**Key Features:**
- Engineered for the deposition of metals, dielectrics, and organic materials
- Boasts a robust stainless steel box-style vacuum chamber with:
- Innovative dual-door design (front and rear) facilitating glovebox integration
- Operational access through either the glovebox-connected front door or the conventional external rear door
- Thoughtfully designed chamber geometry featuring a high aspect ratio:
- Perfectly suited for long working distance evaporation, ensuring impeccable coating uniformity
- Ready for integration with magnetron sputtering configuration
- Base vacuum pressure <5×10 mbar, ensuring ultra-low pressure environments
- Offers adaptable configuration options tailored to diverse budgetary and operational needs
- Capable of scaling from manual thermal evaporation to advanced fully automated process control with multiple growth recipes
**Deposition Capabilities:**
- High-precision thermal evaporation of metals
- Specialized low-temperature thermal evaporation for organic materials
- Cutting-edge electron beam (e-beam) evaporation technology
- Versatile magnetron sputtering for metals, oxides, nitrides, and insulators
**Technical Highlights:**
1. The innovatively high aspect ratio chamber design ensures optimal geometry for:
- Evaporation processes demanding extensive throw distances
- Sputtering applications when suitably configured
2. Dual-door access empowers:
- Efficient glovebox integration via the front door
- Traditional loading and unloading via the rear door
3. The system ensures ultra-high vacuum compatibility while providing unmatched configuration flexibility
**Modular Pilot-Scale Vacuum Coating System**
**System Concept:**
This cutting-edge system introduces pioneering modular design principles to pilot-scale production, offering:
- Expansive chamber volume enabling:
- Upscaling of component sizes to meet ambitious production goals
- Fulfillment of large-area coating requirements with ease
- Integrated fast-entry load lock chamber for accelerated sample throughput and productivity
- Fully customizable configurations to precisely meet specific coating requirements and applications
**Technical Specifications:**
- Floor-standing vacuum deposition system ideal for metals, dielectrics, and organic thin films
- Durable stainless steel box-style chamber featuring a convenient front access door for effortless sample handling
- Large chamber volume is perfectly suited for:
- Pilot-scale coating applications on a grand scale
- Complex experimental configurations with a range of customizations
- Compatibility with all major deposition components and tailor-made fixtures
- Base vacuum pressure ≤5×10 mbar, maintaining pristine conditions for all operations
- Configurable options that are flexible enough to be tailored to:
- Varied user budgets
- Specific custom application requirements
**Available Deposition Methods:**
- Precision thermal evaporation for metals
- Specialized low-temperature thermal evaporation for organics
- Electron beam (e-beam) evaporation: Benefit from the high precision and efficiency of electron beam evaporation technology, which offers unparalleled coating quality for diverse applications.
- Magnetron sputtering (metals, oxides, nitrides, insulators): Harness the power of advanced magnetron sputtering to achieve exceptional thin-film coatings across a wide range of materials, including metals, oxides, nitrides, and insulators.
**Key Advantages:** Discover the outstanding benefits that set our systems apart in the industry, enhancing your operational capabilities.
1. Modular architecture enables: Experience unparalleled flexibility with our modular design, which allows for seamless adaptability to emerging technological needs.
- Easy component upgrades: Effortlessly enhance your system's performance with simple, rapid upgrades that extend its capabilities.
- Process scalability: Efficiently scale your operations with processes that grow in tandem with your business needs, ensuring future-proofing.
2. Large chamber dimensions facilitate: Maximize your production potential with expansive chamber sizes that accommodate a broader range of applications.
- Multiple source configurations: Tailor your system to suit specific project requirements with versatile source configuration options.
- Uniform large-area deposition: Achieve consistent, high-quality coatings across extensive surface areas, enhancing product reliability.
3. Customizable design supports: Leverage a design tailored to your unique specifications, enhancing operational efficiency and innovation.
- Research and development needs: Propel your R&D efforts forward with a system designed for experimentation and innovation.
- Small-batch production requirements: Perfectly suited for low-volume production, our customizable design meets diverse manufacturing needs.
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