Advanced High-Vacuum Multi-Arc Ion Plating Equipment for Precision Coating

• Customization: Available
• After-sales Service: on-Line Service
• Warranty: One Year
• Model NO.: Made-to-order
• Type: Vacuum Coating
• Coating: Vacuum Coating
• Substrate: Steel
• Certification: CE
• Condition: New
• Transport Package: Wooden Case
• Specification: Customized
• Trademark: RJ
• Origin: Zhengzhou, China

Product Description

High-vacuum multi-arc ion plating system for preparing multicomponent amorphous alloys, depositing metallic compound films (such as oxides and nitrides in oxygen or nitrogen atmosphere), fabricating nanoparticle catalyst films, and preparing thermoelectric thin films using thermoelectric target materials.

Using arc discharge to ionize conductive materials and leveraging their excellent diffraction properties, high-energy ions are generated and deposited onto substrates (especially porous substrates like nickel foam) to prepare nanoscale thin film coatings or nanoparticles. The equipment mainly consists of a coating chamber, multi-arc targets, multi-arc power supplies, pulsed bias power supplies, sample stage, heating system, vacuum system, gas delivery system, and a PLC+touchscreen semi-automatic control system. The device features an integrated design of the main unit and control system for convenient operation, as well as a compact structure with a small footprint.

This series of equipment is widely used in teaching and scientific research experiments at universities and research institutes, as well as exploratory experiments and new product development in production-oriented enterprises. It has been highly praised by users.

Item	Specification
1. Vacuum Chamber	Φ500×420mmΦ500×H420mm, high-grade 304 stainless steel, front-opening structure; chamber heating temperature: room temperature −350±1∘C−350±1∘C;
2. Vacuum System	High-vacuum system combining a compound molecular pump, direct-drive rotary vane pump, and high-vacuum valve, equipped with a compound vacuum gauge;
3. Ultimate Vacuum	Better than 6.0×10−5Pa6.0×10−5Pa (no load, after baking and degassing);
4. Leak Rate	Pressure rise rate ≤0.8Pa/h≤0.8Pa/h; Pressure holding: After pump shutdown for 12 hours, vacuum ≤103Pa≤103Pa;
5. Pumping Speed	(No load) From atmosphere to 5.0×10−3Pa≤15min5.0×10−3Pa≤15min;
6. Substrate Stage Size	Φ150mmΦ150mm, with 3 self-rotating stations;
7. Substrate Rotation	Rotation speed: 0∼20rpm0∼20rpm;
8. Sputtering Targets	2 sets of DM100 new-type magnetic-filtered multi-arc targets;
9. Pulsed Bias Power Supply	−1000V−1000V, 1 set;
10. Control Method	PLC + touchscreen HMI semi-automatic control system;
11. Alarms & Protection	Alarms and protective measures for abnormal conditions such as water shortage in pumps, overcurrent/overvoltage, circuit breaks, etc.; comprehensive logic interlock protection system;
12. Dimensions (Main Unit)	1900×800×1900mmL1900×W800×H1900mm.