| Customization: | Available |
|---|---|
| After-sales Service: | on-Line Service |
| Warranty: | One Year |
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This cutting-edge, user-friendly system showcases an exquisite design, featuring a sophisticated 'flip-top' vacuum chamber ensuring effortless operation, making it ideal for versatile applications like thermal evaporation and sputter deposition of a variety of materials including metals, dielectrics, and organic substances.
Boasting an Integrated design where the vacuum chamber is artfully recessed into the supportive frame, enhancing stability and accessibility.
Chamber optionsinclude an intuitive flip-top lid or a classic bell-jar configuration.
Multi-deposition technologies:
Thermal evaporation for metals & organics, ensuring precision and quality.
Low-temperature evaporation for crafting delicate organic films with precision control.
Magnetron sputtering capable of processing metals, oxides, nitrides, and insulators for diverse applications.
Deposition source layoutis strategically designed with sources mounted at the bottom, while substrates are positioned at the top accommodating wafers up to 6 inches in diameter for extensive usability.
Substrate handlingis enhanced with features like Heating, rotation, and Z-shift adjustment, ensuring precise and versatile control.
Glovebox-compatibledesign, crafted for seamless integration with existing glovebox systems for enhanced safety and efficiency.
Thermal evaporation specifically designed for metals, ensuring high-quality outputs.
Low-temperature thermal evaporation ideal for organic applications, maintaining integrity and accuracy.
Magnetron sputtering efficiently processes metals, oxides, nitrides, and insulators, broadening application scope.
Vacuum Coating System Description (English Version):
This system stands as a highly-regarded universal platform within our coating series, featuring a convenient front-opening box-style chamber perfectly suited for advanced multi-source magnetron sputtering, in addition to thermal evaporation and electron beam evaporation methods.
Comprehensive Integrated design where the vacuum chamber is meticulously mounted directly atop the control system's electronics cabinet for streamlined operations.
Support for Multi-deposition technologies:
Incorporating Thermal evaporation & low-temperature evaporation for both metals and organic materials, ensuring versatility.
Magnetron sputtering capable of handling metals, oxides, nitrides, and insulators effortlessly.
E-beam evaporation compatible with an array of materials, excluding organics, for optimal flexibility.
Flexible source configuration:
Standard installation of Deposition sources (thermal, e-beam) at the bottom, optimizing space and functionality.
Sputtering sources can be flexibly mounted at the top when needed.
Substrate Handling Excellence:
Capable of accommodating wafer sizes reaching up to 11 inches in diameter.
Our versatile options include advanced heating, precise rotation, customizable bias voltage, and Z-shift adjustment.
Configurable with high-efficiency planetary sample stages, precise source shutters, and advanced substrate shutters.
State-of-the-art Automation Options:
Tailored ranging from manual thermal evaporation processes all the way to fully automated, cutting-edge process control technologies.
In addition, an optional fast-loading chamber is available for swift and seamless sample exchange.
High-quality thermal evaporation (ideal for metals)
Low-temperature thermal evaporation (perfect for organics)
State-of-the-art electron beam (e-beam) evaporation
Advanced magnetron sputtering (compatible with metals, oxides, nitrides, and insulators)
High-Volume Vacuum Coating System: Pioneering Technology
Distinctive Key Features:
Innovative tall-chamber design finely tuned for thermal, low-temperature thermal, and e-beam evaporation, boasting extended working distance for unparalleled film uniformity
Vacuum chamber expertly mounted directly on the control system electronics cabinet
Perfect for evaporation techniques that demand longer working distances for superior uniformity
Near-90° evaporation incidence angle ensures impeccable lift-off performance for photolithographic devices
Capable of supporting innovative multi-process deposition:
Classic thermal evaporation (metals)
Pioneering organic thermal evaporation
Cutting-edge e-beam evaporation
Versatile magnetron sputtering (operating as a hybrid growth system)
Comprehensive Deposition Methods Available:
Traditional thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
State-of-the-art electron beam (e-beam) evaporation
Advanced magnetron sputtering (metals, oxides, nitrides, insulators)
System Configuration: Flexibility Unmatched
Ranging from standard manual thermal evaporation to comprehensive fully automated process control featuring multiple growth recipes for diverse needs
With an optional fast-entry load lock chamber available for use when desired
The top-mounted sample stage efficiently accommodates substrates of up to 11 inches in expansive diameter
A Spectrum of Available Options:
Premium substrate heating
Dynamic rotation options
Customizable bias voltage available
Z-shift adjustment
Configurable with:
Planetary sample stage
Source shutters
Substrate shutters
**Glovebox-Compatible Thin Film Deposition System**
**System Overview:**
This innovative, floor-standing PVD system, masterfully crafted for glovebox integration, facilitates the precise deposition of air-sensitive thin films. Its high-chamber design is meticulously engineered for superior high-performance evaporation processes and seamlessly integrates with magnetron sputtering deposition, ensuring versatility and excellence.
**Key Features:**
- Expertly designed for the deposition of metals, dielectrics, and organic materials
- Equipped with a robust stainless steel box-style vacuum chamber featuring:
- Ingenious dual-door design (front and rear) for optimal glovebox integration
- Convenient operation access through either the glovebox-connected front door or the external rear door, maximizing functionality
- Optimized chamber geometry with a high aspect ratio:
- Perfect for long working distance evaporation, delivering superior coating uniformity
- Fully compatible with magnetron sputtering configurations
- Achieves base vacuum pressure of less than <5×10 mbar
- Offers flexible configuration options to accommodate varying budgets and diverse requirements
- Scalable from simple manual thermal evaporation to sophisticated, fully automated process control with multiple growth recipes
**Deposition Capabilities:**
- High-performance thermal evaporation for metals
- Advanced low-temperature thermal evaporation for organics
- Cutting-edge electron beam (e-beam) evaporation
- Versatile magnetron sputtering for metals, oxides, nitrides, and insulators
**Technical Highlights:**
1. The chamber's high aspect ratio design provides an optimal geometry for:
- Exceptional evaporation processes requiring extended throw distances
- Effective sputtering applications when configured appropriately
2. Dual-door access enhances system functionality by enabling:
- Seamless glovebox integration via the front door
- Effortless conventional loading through the rear door
3. System maintains ultra-high vacuum compatibility, offering unparalleled configuration flexibility for diverse applications
**Modular Pilot-Scale Vacuum Coating System**
**System Concept:**
This cutting-edge system introduces pioneering modular design principles to pilot-scale production, featuring:
- A generously large chamber volume enabling:
- Effortless upscaling of component sizes
- Seamless accommodation of large-area coating requirements
- An integrated fast-entry load lock chamber for enhanced sample throughput and efficiency
- Comprehensive customization options to precisely meet specific coating requirements
**Technical Specifications:**
- A distinguished floor-standing vacuum deposition system engineered for metals, dielectrics, and organic thin films
- Durable stainless steel box-style chamber with a front access door for seamless sample handling
- The expansive chamber volume supports:
- Pilot-scale coating applications of varied scope
- Complex experimental configurations for advanced research
- Ensures compatibility with all major deposition components and custom fixtures
- Capable of achieving a base vacuum pressure ≤5×10 mbar
- Offers flexible configuration options tailored to:
- Diverse user budgets
- Specific application requirements for optimized performance
**Available Deposition Methods:**
- High-quality thermal evaporation for metals
- Innovative low-temperature thermal evaporation for organic materials
- Experience the precision of electron beam (e-beam) evaporation, a technique that ensures superior thin film deposition.
- Discover the versatility of magnetron sputtering, suitable for a wide range of materials including metals, oxides, nitrides, and insulators.
**Key Advantages:**
1. Embrace the future with our modular architecture that offers unparalleled flexibility, enabling:
- Seamless component upgrades to keep your system at the cutting edge of innovation.
- Exceptional process scalability, adapting effortlessly to your evolving needs.
2. Our spacious chamber dimensions are engineered to optimize your processes by facilitating:
- Diverse multiple source configurations, enhancing versatility and productivity.
- Consistently uniform large-area deposition, ensuring quality and efficiency every time.
3. Tailor your solutions with our customizable design, perfect for:
- Addressing the intricate demands of research and development.
- Meeting the unique challenges of small-batch production requirements with ease.
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