| Customization: | Available |
|---|---|
| After-sales Service: | on-Line Service |
| Warranty: | One Year |
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Embrace intuitive interaction with this cutting-edge, user-friendly system that boasts a remarkable innovative "flip-top" vacuum chamber, designed for seamless operation. Effortlessly navigate operations, perfectly suited for diverse applications such as thermal evaporation and advanced sputter deposition techniques, allowing comprehensive coverage of metals, dielectrics, and organic materials.
Revolutionary Integrated Design exemplified by the vacuum chamber partially recessed into an innovative support frame.
Versatile Chamber Options: Choose between a flip-top lid or a classic bell-jar configuration.
Comprehensive Multi-Deposition Technologies:
Pioneering Thermal Evaporation (ideal for both metals & organics)
Innovative Low-Temperature Evaporation (perfect for organic films)
Sophisticated Magnetron Sputtering (suitable for metals, oxides, nitrides, insulators)
Optimal Deposition Source Layout: Ingeniously designed with sources mounted at the bottom,while substrates are positioned at the top, accommodating wafers up to an impressive 6 inches in diameter).
Advanced Substrate Handling: Incorporates features like heating, rotation, and a precise Z-shift adjustment for optimal performance.
Glovebox-Compatible Integration: Specifically crafted for flawless compatibility with existing glovebox systems.
Precision Thermal Evaporation (meticulously crafted for metals)
Efficient Low-Temperature Thermal Evaporation (tailored for organics)
State-of-the-Art Magnetron Sputtering (engineered for metals, oxides, nitrides, insulators)
Vacuum Coating System Description (English Version):
Elevate your coating capabilities with this sought-after universal platform in our series, featuring a strategically designed front-opening box-style chamber, perfect for utilizing multi-source magnetron sputtering, as well as benefiting from thermal evaporation and refined electron beam evaporation techniques.
Innovative Integrated Design showcasing the vacuum chamber mounted directly on the control system's electronics cabinet for seamless operation.
Extensive Multi-Deposition Technologies Supported:
Advanced Thermal Evaporation & Low-Temperature Evaporation (exclusively for metals and organic materials)
Leading-Edge Magnetron Sputtering (applicable for metals, oxides, nitrides, and insulators)
Efficient E-beam Evaporation (designed for compatibility with most materials excluding organics)
Flexible Source Configuration:
Deposition sources (thermal, e-beam) are skillfully installed at the bottom.Additionally, sputtering sources can be expertly mounted at the
top. if required.
Substrate handling:
Proudly accommodates wafer sizes up to 11 inches.
Options include a comprehensive suite of capabilities such as heating, rotation, bias voltage, and Z-shift adjustment.
Configurable with an impressive array of features, including planetary sample stages, source shutters, and substrate shutters.
Automation options:
Our flexible automation ranges from manual thermal evaporation to fully automated process control.
Optional fast-loading chamber ensures rapid sample exchange and minimal downtime.
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Electron beam (e-beam) evaporation
Magnetron sputtering (metals, oxides, nitrides, insulators)
High-Volume Vacuum Coating System
Key Features:
Tall-chamber design engineered for optimal thermal evaporation, low-temperature thermal evaporation, and e-beam evaporation with an extended working distance for unparalleled film uniformity
Vacuum chamber strategically mounted directly on the control system electronics cabinet
Ideal for evaporation techniques requiring extended working distances to ensure optimal uniformity
Near-90° evaporation incidence angle delivers outstanding lift-off performance for photolithographic devices
Supports multi-process deposition:
Thermal evaporation (metals)
Organic thermal evaporation
E-beam evaporation
Magnetron sputtering (as a versatile hybrid growth system)
Available Deposition Methods:
Thermal evaporation (metals)
Low-temperature thermal evaporation (organics)
Electron beam (e-beam) evaporation
Magnetron sputtering (metals, oxides, nitrides, insulators)
System Configuration:
Boasting a range from manual thermal evaporation to fully automated process control complete with multiple growth recipes for tailored application needs
Optional fast-entry load lock chamber available for when efficiency and speed are paramount
Top-mounted sample stage proficiently accommodates substrates up to 11 inches in diameter
Available options include:
Substrate heating
Rotation
Bias voltage
Z-shift adjustment
Configurable with:
Planetary sample stage
Source shutters
Substrate shutters
**Glovebox-Compatible Thin Film Deposition System**
**System Overview:**
Ingeniously designed for glovebox integration, this floor-standing PVD system facilitates the deposition of air-sensitive thin films with superior precision. The elevated chamber design shines in high-performance evaporation processes while seamlessly supporting magnetron sputtering deposition.
**Key Features:**
- Expertly crafted for the deposition of metals, dielectrics, and organic materials
- Incorporates a robust stainless steel box-style vacuum chamber featuring:
- A dual-door design (front and rear) perfect for glovebox integration
- Operational access through either the glovebox-connected front door or the external rear door
- Enhanced chamber geometry with an optimized high aspect ratio:
- Perfect for long working distance evaporation, ensuring exceptional coating uniformity
- Seamlessly integrates with magnetron sputtering configuration
- Achieves a base vacuum pressure of <5×10 mbar
- Offers flexible configuration options to suit diverse budgets and requirements
- Scalable from manual thermal evaporation to advanced fully automated process control with multiple growth recipes
**Deposition Capabilities:**
- Thermal evaporation (metals)
- Low-temperature thermal evaporation (organics)
- Electron beam (e-beam) evaporation
- Magnetron sputtering (metals, oxides, nitrides, insulators)
**Technical Highlights:**
1. The chamber's high aspect ratio design offers optimal geometry for:
- Evaporation processes demanding long throw distances
- Sputtering applications when suitably configured
2. Dual-door access facilitates:
- Seamless glovebox integration via the front door
- Traditional loading options through the rear door
3. The system supports ultra-high vacuum compatibility while providing remarkable configuration flexibility
**Modular Pilot-Scale Vacuum Coating System**
**System Concept:**
Embracing modular design principles, this system caters to pilot-scale production with features including:
- Expansive chamber volume enabling:
- Upscaling of component sizes
- Addressing large-area coating needs
- Integrated fast-entry load lock chamber for improved sample throughput
- Completely customizable configuration to meet exact coating requirements
**Technical Specifications:**
- A floor-standing vacuum deposition system optimized for metals, dielectrics, and organic thin films
- Stainless steel box-style chamber with a front access door for easy sample handling
- Generous chamber volume supports:
- Pilot-scale coating applications
- Complex experimental configurations
- Compatibility with all major deposition components and bespoke fixtures
- Base vacuum pressure of ≤5×10 mbar
- Versatile configuration options tailored to:
- User budgets
- Specific application demands
**Available Deposition Methods:**
- Thermal evaporation (metals)
- Low-temperature thermal evaporation (organics)
- Dive into precision with advanced Electron Beam (E-Beam) Evaporation, a technology renowned for its unparalleled accuracy and efficiency in depositing thin films.
- Unlock endless possibilities with Magnetron Sputtering, designed for a vast array of materials including metals, oxides, nitrides, and insulators, ensuring superior film quality and versatility.
**Key Advantages:**
1. Experience the ultimate in flexibility with our Modular Architecture, which allows for:
- Seamless and swift component upgrades, ensuring your system stays at the cutting edge of technology.
- Effortless process scalability, enabling you to easily adapt to new production demands and technological advancements.
2. Benefit from our expansive Large Chamber Dimensions that provide:
- A multitude of source configurations, granting you the freedom to tailor processes to specific needs.
- Exceptional uniformity in large-area deposition, ensuring consistent quality across extensive surfaces.
3. Embrace innovation with our Customizable Design, perfect for:
- Catering to the dynamic requirements of research and development, fostering groundbreaking advancements.
- Meeting the unique demands of small-batch production, allowing for bespoke manufacturing solutions.
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